Quality WiFi7 Module & WiFi HaLow Module manufacturer

Smart connected vehicles are emerging as one of the most确定性 growth trajectories in the global technology industry.   China's intelligent connected vehicle production is projected to reach 14.064 million units in 2026, with market penetration expanding to 38.40%. From 4.6915 million units in 2021 to 14.064 million units in 2026, this figure has nearly tripled in just five years, representing a compound annual growth rate of 24.8%. Revenue from in-vehicle intelligent connected solutions is expected to reach 236.5 billion yuan. iiMedia Research data shows that China's intelligent connected vehicle application service market has already reached 222.3 billion yuan in 2025. On a global scale, the growth trajectory is equally steep. Research and Markets data indicates that the global connected vehicle technology market will grow from $45.99 billion in 2025 to $51.86 billion in 2026, reaching $84.54 billion by 2030 at a CAGR of 13%**. The broader connected cars market is forecast to expand from $105.67 billion in 2025 to $121.23 billion in 2026, and further to **$214.42 billion by 2030 at a CAGR of 15.3%. According to TechNavio, the global connected car market is forecast to grow by $161.69 billion during 2025-2030, accelerating at a CAGR of 17.2%. Communication and navigation terminals are transitioning from vehicle "options" to "standard equipment" —this is not incremental improvement but a structural reconfiguration of the industry's underlying logic. The connectivity demands of intelligent connected vehicles are extending in two directions: inside the vehicle, intelligent cockpits require high-bandwidth, low-latency wireless connectivity; outside the vehicle, charging infrastructure demands intelligent communication via power line carrier technology. Ofeixin Technology delivers a full-stack connectivity solution covering both the "vehicle side" and the "energy side" of intelligent connected vehicles, with Wi-Fi 7 + Bluetooth 6.0 in-vehicle wireless solutions and PLC charging pile communication solutions. I. The Bandwidth Revolution in Intelligent Cockpits: Wi-Fi 7 Ushers in a New Era of In-Vehicle Connectivity Wi-Fi 7, as the next-generation standard following Wi-Fi 6, is becoming the core infrastructure for wireless connectivity in intelligent cockpits. In January 2026, the Wi-Fi Alliance officially opened Wi-Fi 7 certification. From certification opening to module mass production delivery, the pace of commercialization for this technological iteration has far exceeded market expectations. Automotive-grade Wi-Fi 7 modules completed AEC-Q104 qualification and entered small-batch trial production in Q4 2025, with theoretical peak data rates 4.8 times higher than Wi-Fi 6, significantly supporting high-bandwidth scenarios such as high-definition map streaming updates and in-vehicle AR navigation. Industry players have already demonstrated clear commercialization signals—LG Innotek has secured orders from a leading European automotive parts supplier to begin shipping automotive-grade Wi-Fi 7 and Bluetooth wireless communication modules in 2027, with the order valued at approximately $68 million. The global automotive Wi-Fi/Bluetooth module market is projected to reach $4.28 billion in 2026, surpassing $6.83 billion by 2030. Wi-Fi modules have become a core procurement category in the intelligent cockpit domain, accounting for 76% of Wi-Fi module procurement demand. Single-chip solution shipments accounted for 42.5% of total volume in 2025 and are expected to exceed 50% in 2026. Chinese domestic OEM procurement demand for dual-band concurrent modules grew 23% year-over-year in 2025, making China the fastest-growing single market globally. In the Wi-Fi 7 automotive module space, Ofeixin Technology has completed a flagship product lineup. The O2072PM (PCIe M.2 interface) and O2072PB (SMD version) are automotive-grade Wi-Fi 7 modules designed based on Qualcomm's QCC2072 (FastConnect C7700) chipset. Both modules comply with IEEE 802.11a/b/g/n/ac/ax/be standards, support tri-band 2.4 GHz/5 GHz/6 GHz concurrent operation, with 6 GHz band channel bandwidth up to 320 MHz, and peak data rates reaching 5.8 Gbps. Both modules support Enhanced Multi-Link Single Radio (eMLSR) and 2×2 Multi-User Multiple-Input Multiple-Output (MU-MIMO), enabling flexible frequency resource scheduling in scenarios with multiple in-vehicle concurrent connections and complex signal interference. The O2072PM and O2072PB are among the few module products on the market that simultaneously support Wi-Fi 7 and Bluetooth 6.0, with the Bluetooth section directly supporting Bluetooth 6.0 and Channel Sounding functionality—providing a complete technology foundation for high-precision positioning scenarios such as digital car keys. II. From "Connectivity" to "Perception": Bluetooth 6.0 Redefines Human-Vehicle Interaction Bluetooth technology is undergoing an upgrade from a "connectivity tool" to a "perception infrastructure." Bluetooth 6.0's introduction of Channel Sounding technology brings centimeter-level high-precision distance measurement capability to Bluetooth. Channel Sounding combines RTT (Round-Trip Time) and phase-based ranging to achieve high-precision distance measurement, representing a qualitative leap from the meter-level error of traditional BLE solutions that relied on RSSI (Received Signal Strength Indicator). Bluetooth Channel Sounding technology achieves accuracy within 0.5 meters with relay attack protection, and will be the first to be deployed in automotive digital car keys in 2026. Industry solutions have already matured. Quectel released its next-generation automotive digital key solution in April 2026, featuring BLE 6.0 + UWB + NFC tri-mode fusion technology. Yuanfeng Technology also announced it will be the industry's first to launch a multi-node Bluetooth 6.0 Channel Sounding technology solution in the second half of 2026. Industry data shows that over 13.2 million vehicles were equipped with digital key functionality as standard in 2025. Bluetooth device annual shipments are projected to reach 5.9 billion units in 2026, with the 2030 annual shipment forecast reaching 8.1 billion units. The Bluetooth 6.0 market was valued at $5.42 billion in 2025 and is expected to grow to $17.47 billion by 2035. According to DIGITIMES, Bluetooth Channel Sounding, leveraging its established ecosystem advantages, is penetrating the precision ranging market, with large-scale adoption by application vendors expected to commence from the second half of 2026 through 2027. The O2072PM and O2072PB modules from Ofeixin Technology, with their integrated Bluetooth 6.0 functionality, offer distinct advantages in digital car keys, in-vehicle personnel positioning, and other scenarios. Both modules support High Accuracy Distance Measurement (HADM), LE Audio, 2 Mbps Bluetooth Low Energy, and other complete Bluetooth features. Bluetooth shares an antenna with 2.4 GHz WLAN while operating concurrently with 5 GHz/6 GHz WLAN, providing flexible configuration options for in-vehicle multi-protocol concurrency. Wi-Fi/Bluetooth combo module shipments reached 71% in 2026 and are expected to exceed 85% by 2030. Ofeixin's O2072PM/O2072PB solution is a representative example of this trend—delivering high-speed Wi-Fi connectivity and precise Bluetooth perception simultaneously on a single module, providing intelligent cockpits with an integrated "one network, multiple capabilities" solution. III. The "Invisible Communication Network" of Charging Infrastructure: PLC's Mandatory Upgrade Window In the industrial landscape of intelligent connected vehicles, charging infrastructure is an indispensable component. And PLC (Power Line Communication) technology is emerging as the core solution for electric vehicle charging pile communication. EU regulations are mandating a comprehensive upgrade of charging pile communication methods. Under EU Delegated Regulation (EU) 2025/656, which sets a mandatory compliance deadline of 2027, developing next-generation smart AC charging piles that comply with EN ISO 15118-20:2022 has become the only path for products to enter the European market. This means the traditional PWM communication method will be phased out, with a complete transition to high-layer communication based on GreenPHY Power Line Communication (PLC), with mandatory integration of Plug & Charge (PnC) and Vehicle-to-Grid (V2G) capabilities. The global Power Line Communication (PLC) market is projected to grow from $12.74 billion in 2025 to $14.29 billion in 2026 at a CAGR of 12.1%. By 2030, the market is expected to reach $22.66 billion. Among the key growth drivers are the expansion of electric vehicle charging networks. As electrification, distributed energy resources, electric vehicle charging, and smart city programs expand, PLC is becoming an important layer in the broader industrial IoT and smart grid communications ecosystem. PLC communication requires no additional communication wiring—it transmits data while transmitting power. This "two-in-one" characteristic gives PLC a natural advantage in charging pile scenarios: no need for rewiring, directly utilizing existing power lines to complete two-way data exchange between vehicle and charging pile, and between charging pile and the cloud. Effective from January 8, 2026, all newly installed or significantly upgraded publicly accessible AC charging piles must support EN ISO 15118-2:2016. This means PLC communication capability is transitioning from a "nice-to-have" to a "must-have." Ofeixin Technology offers a complete PLC module product portfolio. The S130N-ISI is a fully integrated Power Line Communication module, designed based on the LianXinTong VC6330 chip, integrating a 32-bit ARM Cortex M3 MCU, 32-bit DSP, embedded Flash, 1MB SRAM, and rich communication interfaces. The module adopts LCC packaging with ultra-compact dimensions, integrating line drivers on-chip with low power consumption and strong anti-noise capability. In charging piles, photovoltaic communications, and other scenarios, Ofeixin's S130N-ISI module enables reliable device communication through existing power lines—one power line, simultaneously delivering power and data. With the mandatory implementation of EU regulations and the continued expansion of global electric vehicle charging infrastructure, market demand for PLC modules in charging pile scenarios is poised for explosive growth. IV. From Cockpit to Infrastructure: The Connectivity Foundation of Intelligent Connected Vehicles Intelligent connected vehicles and the Internet of Vehicles are racing ahead at a compound annual growth rate exceeding 30%. In this process, in-vehicle wireless communication modules have transitioned from "behind-the-scenes配角" to "core hub." On the intelligent cockpit side, they are the transmission channels for multi-screen interaction, the positioning foundation for digital car keys enabling keyless entry, and the connectivity safeguard for OTA upgrades ensuring continuous vehicle evolution. On the charging infrastructure side, they are the communication cornerstone enabling intelligent functions such as Plug & Charge and V2G bidirectional charging. Ofeixin Technology's in-vehicle connectivity solutions present a clear "dual-track" architecture: On the intelligent cockpit and digital key front, the O2072PM and O2072PB deliver Wi-Fi 7 + Bluetooth 6.0 combination, covering differentiated requirements from high-end intelligent cockpits to next-generation digital car keys. The 5.8 Gbps peak data rate supports the high-bandwidth demands of multi-screen HD video streaming and in-vehicle AR navigation; Bluetooth 6.0 Channel Sounding provides centimeter-level precise positioning foundation for digital car keys. The interface format differences between the two modules—PCIe M.2 versus SMD package—offer flexible selection options for different in-vehicle hardware architectures. On the charging infrastructure front, the S130N-ISI and other PLC module products are addressing the mandatory upgrade requirements brought by new EU regulations, providing GreenPHY PLC communication capability compliant with ISO 15118-20 standards for charging piles. With upstream partnerships with Qualcomm and other leading chip original equipment manufacturers, Ofeixin Technology rapidly transforms the latest chip platforms into mass-producible module products. From Wi-Fi 7 + Bluetooth 6.0 in-vehicle wireless solutions to charging pile PLC communication solutions, the full-stack coverage enables Ofeixin to deliver complete wireless module solutions for intelligent connected vehicles—from in-vehicle connectivity to infrastructure communication. This represents both the completeness of the product portfolio and the flexibility to address different scenarios and requirements. Looking ahead to 2027-2030, composite communication modules integrating 5G cellular are gradually penetrating mid-to-low-end vehicle segments, while software-defined vehicle architectures demand higher programmability and security isolation capabilities from modules. The rigid demand of intelligent cockpits and autonomous driving for high-speed, reliable data links, combined with the mandatory upgrade window created by EU charging pile regulations, will together ensure the long-term positive fundamentals of both the in-vehicle wireless communication and charging infrastructure communication module markets.  

On August 19, 2026, the 11th World Robot Conference (WRC) officially opened at the Beiren Yichuang International Convention Center in Beijing’s E-Town, running through August 23 under the theme “Human-Robot Symbiosis, Production-Demand Convergence.” The scale set new records: more than 300 exhibitors (up 36% year-over-year) presented over 2,000 exhibits, with more than 150 products making their global debut. More than 17,800 contestants from 26 countries are competing across the conference‘s robotics contests. If previous WRC editions were “technology showcases,” WRC 2026 is an “industrial acceptance test.” The most significant shift is structural, not cosmetic. The conference introduced four themed days — Launch Day (Aug 19), a first-ever Procurement Day (Aug 20), Developer Day (Aug 21), and Public Days (Aug 22–23). A dedicated pavilion gathered 49 centrally administered state-owned enterprises presenting 12 real-world application scenarios — one of the strongest procurement signals the Chinese robot industry has ever staged. As one observer put it: last year‘s WRC answered whether robots can work; this year the industry answers how well they work, how much they cost, who buys them, and whether they can be deployed at scale. I. WRC 2026 Signals: The “Acceptance Test” of Physical AI The signals from this year’s conference are clear and strong: the robotics industry is moving from “single-technology demonstrations” to a new phase of “technological innovation + industry-demand alignment + global collaborative governance.” Trend One: From “Muscle” to “Brain.” Goldman Sachs’ July 2026 research report explicitly noted that the industry’s center of gravity is shifting from “physical capabilities” to “intelligent decision-making.” On the WRC floor, the Beijing Humanoid Robot Innovation Center unveiled the Pelican-Unify 1.0 unified embodied model and the Tiangong Omni — a lightweight humanoid robot open platform designed for the embodied AI ecosystem. Xinghaitu demonstrated the application results of the world’s first end-to-end full-body control model. The industry consensus is forming: the ultimate competition in embodied intelligence is not in motors and joints, but in foundational models and the data flywheel accumulated through continuous interaction with the real physical world. Trend Two: From “Showing Off” to “Real Work.” On the exhibition floor, robots are doing real work rather than performing. The firefighting humanoid robot Linglong L2.0 can easily climb over rubble and stairs. Fourier’s GR-3 humanoid robot acts as an “intelligent butler assistant” in simulated home scenarios. Keenon Robotics’ XMAN series autonomously completes the entire coffee extraction process. As Li Tong, founder and CEO of Keenon Robotics, stated: “Whether robots can actually do real work is the essence of humanoid robot commercialization.” Trend Three: Accelerated Industry Chain Closure. IDC’s latest MarketGlance: China Embodied AI Robotics, 3Q26 report divides the current industry into six market segments: computing infrastructure, model algorithms, data engines, robot bodies, core components and infrastructure, and industry application agents. The four exhibition halls of WRC 2026 — Innovation, Exchange, Manufacturing, and Fun — precisely cover the complete chain from underlying technology and core components to finished robot applications. Guangdong sent 34 companies spanning the full robot supply chain, from upstream EVE Energy batteries and ORBBEC 3D vision sensors, through midstream CVTE control boards and Neoway 5G communication modules, to downstream UBTECH, Dobot, and LimX Dynamics full machines. II. Communication Modules: The Underestimated “Nervous System” When industry attention focuses on the “brain” (AI models) and the “body” (joints and actuators), a critical question emerges: connectivity is becoming a key factor in determining whether robots are truly deployable. If large models are the robot’s “brain,” then the communication network is its “nervous system” — this “brain” must process massive heterogeneous data from dozens of sensors distributed across the body within milliseconds, and issue synchronized instructions to actuators within microseconds. Whether humanoid robots or autonomous mobile robots (AMRs), actual deployment imposes unprecedented demands on wireless connectivity: ultra-low latency, ultra-high bandwidth, high reliability, and multi-device concurrency. Industry research indicates that the internal and external communication architectures of robots are facing unprecedented restructuring, with traditional industrial robot communication architectures approaching their physical limits. The market size for embodied AI robot-dedicated communication is expected to expand rapidly from $42 million in 2026 to approximately $300 million by 2030. More宏观 data confirms this trajectory. QYResearch shows that the global robot communication module market was approximately $8.12 billion in 2025 and is projected to reach $21.61 billion by 2032, with a compound annual growth rate of 15.1% from 2026 to 2032. Research institutions further point out that driven by market prosperity and chip specialization, communication modules will witness nearly RMB 10 billion in incremental growth. The value of the communication link is undergoing a structural reorganization — from “general industrial component” to “dedicated core component.” III. The Communication Module Ecosystem at WRC 2026 WRC 2026 clearly displays the complete ecosystem of robot communication modules. In wireless communication, Neoway Technology showcased its 5G communication modules for the midstream industry, demonstrating a rich portfolio of products and solutions for robot collaborative communication scenarios. Realtek Semiconductor exhibited its communication transmission chip integration solutions for humanoid and industrial robots, featuring Wi-Fi 8 2×2 and 5GHz 3T3R high-end wireless modules to ensure real-time protocol and high-speed data exchange between robots. The 34 Guangdong companies formed a complete closed loop from upstream power batteries and 3D vision sensors, through midstream control motherboards and 5G communication modules, to downstream finished robots. In control and communication integration, GigaDevice demonstrated joint module solutions based on GD32 series MCUs, compatible with CANopenNode protocol and equipped with CANFD and RS485 dual industrial buses. JWIPC and CVTE provided control motherboards and edge computing platforms. These highly integrated control solutions represent the typical application of PLC (Power Line Communication) technology in robot motion control — achieving precise, real-time joint control through industrial buses, which is the key neural pathway through which the robot’s “brain” commands its “body.” In perception and safety, ORBBEC demonstrated robot-dedicated 3D depth camera modules, while Lingsi Intelligent and Saigan Technology provided perception and safety modules. These modules constitute the robot’s “sensory system,” forming the foundation for environmental perception and safe interaction. IV. Qogrisys Business Portfolio: A Full-Stack Connectivity Foundation from Wi-Fi 7 to PLC In the industry landscape revealed by WRC 2026, the role of communication module suppliers is upgrading from “standard component providers” to “builders of robot nervous systems.” Qogrisys business portfolio precisely covers multiple critical dimensions of this transformation. Wi-Fi 7 Modules: High-Speed Neural Pathways for Embodied Intelligence. Qogrisys has launched Wi-Fi 7 module product lines for high-end robots and industrial equipment. Among them, the O2072PM, based on Qualcomm’s QCC2072 chip, is a Wi-Fi 7 + Bluetooth 6.0 tri-band 2×2 MIMO module supporting 2.4/5/6 GHz bands, with up to 320 MHz bandwidth across all bands, peak speeds of up to 5.8 Gbps, 4096-QAM modulation, and Multi-Link Operation (MLO) capabilities. Bluetooth supports BLE 6.0 and LE Audio. In addition, These performance metrics directly address the rigid demand for ultra-low latency and ultra-high bandwidth wireless connectivity in embodied AI robots. Bluetooth and Multi-Protocol Modules: The Foundation of Diverse Connectivity. Qogrisys‘ product portfolio covers 2.4G/5.8G/6G series Wi-Fi modules, Wi-Fi HaLow, Nearlink, and Bluetooth (BLE) modules. Its Bluetooth modules support the latest standards including BLE 6.0 and LE Audio. In robot scenarios, different communication protocols serve different connectivity needs — Wi-Fi carries high-bandwidth data backhaul, Bluetooth handles low-power device interconnection, and Wi-Fi HaLow is suitable for long-distance low-power scenarios. Multi-protocol parallelism has become a standard capability of robot communication modules. PLC Modules: The “Invisible Infrastructure” of Power Line Communication. In August 2026, Qogrisys has formed a complete technology matrix in the PLC domain. Its 3121N-H module, based on the HiSilicon Hi3121S chip, achieves a physical layer peak rate of 0.507 Mbit/s, with a single CCO supporting up to 200 STA nodes. The S130N-ISI module features an ultra-compact design measuring just 20.6 × 12.6 mm, integrating a 32-bit ARM Cortex-M3 MCU and a 32-bit DSP dual-core processor. The 3121N-L module is a fully integrated power line carrier communication module equipped with an external LD amplifier and transmitter function. The unique value of PLC technology lies in “where there is power, there is network” — using existing power lines in homes or industrial settings as the data transmission medium, walls, floors, or metal structures blocking the signal. Measured data shows that PLC-IoT end-to-end response latency is stable within 50 milliseconds, with communication success rates as high as 99.99%. In industrial and service scenarios where robots need to be deployed across floors and rooms, PLC provides a stable connectivity guarantee that wireless solutions cannot. Deep Customization Capability: From Modules to Solutions. Qogrisys‘ core R&D team has long the world’s leading wireless chip platforms including Qualcomm, Realtek, WUQI, and HiSilicon, accumulating full-stack experience from chip bring-up and RF calibration to mass production testing. In the trend of the module industry moving from standardization to deep customization, this capability enables the company to provide customized connectivity solutions for different robot form factors and application scenarios. V. Challenges and Opportunities: The Module Industry‘s “Acceptance Test” The industry trends revealed by WRC 2026 bring structural opportunities to the module industry — but challenges are equally. Supply chain pressure continues to intensify. In July 2026, the module industry experienced the most severe component price surge in recent years. PCB prices rose 10%-30%, crystal oscillators 10%-30%, inductors 30%-70%, and MLCCs 10%-70%. Packaging giant ASE officially announced price increases of up to over 20%. Passing down to the module segment, the BOM cost of every Wi-Fi/Bluetooth module is being passively pushed up. Industry report data shows that the industry‘s average gross margin in 2025 fell by 8 percentage points compared to 2024. The market side also faces divergence. Consumer IoT growth has significantly slowed, Wi-Fi 7 penetration is only 8%, and AI module shipments still account for single-digit percentages. Meanwhile, the U.S. FCC is推行 component-level bans, and EU compliance thresholds continue to rise. However, the explosive growth of the robotics industry is opening a high-value growth curve for the module industry. As IDC points out, the robotics industry is transitioning from technology demonstrations and point breakthroughs to product delivery, scenario deployment, and industrial collaboration. IDC‘s 2026 Global CEO Survey shows that 35.2% of CEOs rank Physical AI as a key new technology investment area to focus on over the next 12-24 months. At the opening ceremony, Vice Minister of Industry and Information Technology Xin Guobin stated that Chinese robotics enterprises’ revenue topped RMB 300 billion ($44.45 billion) in 2025, with average annual growth exceeding 20% over the past five years. In the first half of 2026, revenue reached RMB 165.5 billion, up 24.5% year-on-year. Ministry of Industry and Information Technology data shows that China‘s annual humanoid robot production is expected to exceed 100,000 units in 2026. Morgan Stanley has raised its 2026 domestic humanoid robot shipment forecast from 28,000 to 50,000 units, projecting 446,000 units by 2030. Every robot requires communication modules as its “nervous system” — this is not only growth in volume but also a leap in the value of communication modules per robot.     Conclusion WRC 2026 clearly declares to the world: the robotics industry has crossed the stage of “can we build it” and officially entered a new era of “can we use it well and sell it.” In this new era, communication and connectivity technology is no longer an “optional accessory” for robots, but a “core organ.” From the high-speed wireless neural pathways of Wi-Fi 7, to the invisible backbone of PLC over power lines, from the low-power interconnection of Bluetooth, to the wide-area coordination of 5G — the module industry is moving from behind the scenes to center stage, becoming a key force in defining the performance boundaries of robots. For module manufacturers, this is not just a market opportunity to supply components, but a strategic opportunity to deeply participate in and define the future form of robots by providing smarter, more integrated, and more reliable connectivity solutions. As robots move from “showing off” to “delivery,” the module industry is likewise welcoming its own “acceptance test.”  

As Wi-Fi evolved from Wi-Fi 6 and Wi-Fi 6E to Wi-Fi 7, the industry's focus shifted to high-speed connectivity capabilities such as 320MHz, 4096-QAM, and MLO. However, entering 2026, a more noteworthy change is taking place: the value of Wi-Fi 7 is shifting from "faster wireless networks" to "a smarter, more reliable, and more convergent terminal connectivity platform."   At the same time, as technologies such as Bluetooth 6.0, Matter, Thread, Wi-Fi Sensing, and edge AI continue to mature, AI PCs, robots, smart homes, industrial IoT, smart healthcare, and new energy equipment are placing more complex demands on wireless connectivity. This means that the competitive logic for next-generation wireless communication modules is changing: From a single Wi-Fi connection to Wi-Fi + Bluetooth + multi-protocol collaboration; from simply transmitting data to the integration of connectivity, sensing, and edge intelligence. For wireless communication module manufacturers, the real opportunity is no longer just "bringing Wi-Fi 7 into devices", but helping terminal manufacturers build more complete smart connectivity capabilities. I. Wi-Fi 7 is entering a true stage of large-scale deployment, but "high speed" is just the beginning. The most representative technologies of Wi-Fi 7 include 320MHz channels, 4096-QAM, and Multi-Link Operation (MLO). These technologies can significantly improve throughput, reduce latency, and enhance connectivity in complex network environments. However, if we only understand Wi-Fi 7 as "faster Wi-Fi", we are actually underestimating its future value in the IoT market. According to IDC data, in the first quarter of 2026, Wi-Fi 7 accounted for 44.5% of global enterprise WLAN-dependent access point (AP) revenue , a significant increase from 11.8% in the first quarter of 2025. IDC believes that Wi-Fi 7 has become a major driver of growth in enterprise wireless networks. In terms of terminal scale, the Wi-Fi Alliance predicts that global shipments of Wi-Fi 7 devices will reach approximately 1.1 billion units in 2026. Among them, IoT devices will account for approximately 196.1 million units . These two data points deserve special attention. Because it illustrates: The growth of Wi-Fi 7 is no longer limited to routers and enterprise APs; IoT devices are becoming an important source of growth in the next phase. For the module industry, this means that Wi-Fi 7 is expanding from "high-performance network equipment solutions" to "terminal connectivity solutions".   II. The Real Change: Wi-Fi 7 is Entering the IoT, and the IoT's Need for "Speed" is Not as High as Imagined Traditional Wi-Fi 7 emphasizes: 320MHz 4096-QAM Multi-link operation High throughput Multi-user concurrency However, many IoT devices do not require peak speeds of several Gbps at all. For example: Devices such as smart door locks, environmental sensors, smart lighting, HVAC controllers, and industrial sensors may not generate a large amount of data, but they are more concerned with: Connection stability, low power consumption, low latency, reliability under network congestion, and long-term operating capability. Therefore, a very important industry assessment is: The next wave of growth for Wi-Fi 7 may not come from "faster devices," but rather from "more devices starting to use Wi-Fi 7." This is also a structural change that the wireless module industry should pay attention to.   III. AIoT is redefining wireless modules: connectivity is only the first layer of capability. AI is changing how data is processed in IoT devices. Traditional IoT is more about: Sensor → Data Acquisition → Cloud → Command Return And AIoT is gradually becoming: Sensors/cameras/microphones → Local AI inference → Real-time decision-making → Cloud collaboration → Multi-device联动 (Multi-device linkage) This means that the amount of data generated and processed by terminal devices is constantly increasing, while requiring more stable inter-device communication. 21.1 billion in 2025 and is projected to reach approximately 39 billion by 2030 . The increase in the number of devices is only the first layer of change. More importantly, an increasing number of IoT devices are beginning to possess: AI algorithms NPU Local reasoning Voice interaction Visual recognition Multi-sensor fusion Edge computing capabilities Counterpoint Research also identified Edge AI as a key technology direction in its CES 2026 analysis, covering multiple fields such as AI vision, intelligent sensing, edge computing, and AIoT devices. Therefore, wireless modules in the AIoT era are no longer just "networked devices," but are increasingly becoming the connectivity infrastructure in terminal intelligent systems.   IV. From AI Robots to Smart Terminals: Why is Wi-Fi 7 Becoming More and More Important? Robots are a very typical example of observing this trend. A robot with vision, voice, and edge AI capabilities may simultaneously need: **Wi-Fi:** Connect to the cloud, transmit images, perform OTA upgrades, and access AI services; **Bluetooth:** Connects to mobile phones, headphones, gamepads, and other peripheral devices; **UWB/Positioning Technology:** Enables spatial positioning and device interaction; **Thread/Matter:** Connecting the smart home ecosystem; **Edge AI:** Completes local vision, speech, and behavior judgments. Therefore, future robots will not simply be "equipped with a Wi-Fi module". It's more like a: AI computing platform + multi-sensor platform + multi-wireless communication platform. The Wi-Fi Alliance's assessment of Wi-Fi trends for 2026 also explicitly mentions that AI, robotics, automotive, and predictive maintenance are driving Wi-Fi into more industrial IoT applications; in the consumer IoT field, the Matter ecosystem is also further promoting Wi-Fi applications. This means: Robots, AI terminals, smart gateways, and other new devices are likely to become important application scenarios for Wi-Fi 7 modules in the future. V. Bluetooth 6.0 is changing the definition of "Bluetooth module" If Wi-Fi 7 is solving the problem of "high-speed, reliable connectivity", then Bluetooth 6.0 is enabling Bluetooth to evolve from a traditional "short-range connectivity technology" to positioning, ranging, and spatial awareness . The Channel Sounding introduced in Bluetooth Core 6.0 enables more accurate distance measurement through methods such as Phase-Based Ranging (PBR) and Round-Trip Timing (RTT). The Bluetooth SIG believes that this technology will provide new application possibilities for scenarios such as digital keys, asset tracking, smart homes, and industrial equipment. The Bluetooth SIG predicts that global annual shipments of Bluetooth devices will reach approximately 5.9 billion units by 2026 . This means that the application scope of Bluetooth is expanding. past: Bluetooth = connection to headphones, keyboard, mouse, and mobile phone future: Bluetooth = Connectivity + Location + Ranging + Device Discovery + Low Power Awareness Therefore, Wi-Fi 7 and Bluetooth 6.0 are not two independent technological paths. In an increasing number of terminal devices, both will coexist: Wi-Fi is responsible for high-speed IP connectivity, while Bluetooth is responsible for low-power device connectivity, network configuration, peripheral devices, and spatial awareness. This is why next-generation wireless modules are increasingly emphasizing the integration of Wi-Fi and Bluetooth.   VI. From Wi-Fi + Bluetooth to Wi-Fi + Bluetooth + Thread: Multi-protocol convergence is becoming a trend Smart home is the most typical application scenario for the integration of multiple protocols. A complete smart home system may exist simultaneously: Wi-Fi camera Bluetooth door lock Thread sensor Matter Smart Light Wi-Fi gateway Bluetooth remote control Different devices have completely different requirements for power consumption, bandwidth, coverage, and network topology. Therefore, the future of smart homes is not about one protocol "eliminating" another, but about different protocols taking on different roles. More notably, solutions have emerged in the market that integrate Wi-Fi 7, Bluetooth LE, and Thread/802.15.4 onto the same chip platform. This shows that: Multi-protocol integration has moved from the "concept" stage to the productization stage of chips and modules. VII. The real competition in wireless modules is shifting from "chip performance" to "system integration capabilities". The chip is the core of the wireless module, but the chip itself cannot directly determine the connection experience of the final product. From chip to end product, there are still many engineering steps in between: Chip → RF Design → PA/LNA → Filtering and Matching → Antenna → PCB → Driver → Operating System → Protocol Stack → Authentication → Mass Production The issue of radio frequency coexistence will become even more important as Wi-Fi and Bluetooth are increasingly integrated into the same module. 8. From Chips to Modules: The Industry Chain is Entering a "Platformization" Stage From the current perspective of the industrial chain, this change is already quite evident. Qualcomm is continuing to advance Wi-Fi 7, Bluetooth, and next-generation wireless connectivity platforms for AI experiences. Its official product roadmap has expanded from Wi-Fi 7 to Wi-Fi 8, which emphasizes reliable and intelligent connectivity. Chip manufacturers such as Realtek are also continuously promoting the integration of wireless connectivity capabilities such as Wi-Fi 6E, Wi-Fi 7, and Bluetooth. Meanwhile, domestic manufacturers are accelerating their entry into the high-performance Wi-Fi market. QOGRISYS has already developed Wi-Fi 7 and Wi-Fi 6 modules based on Qualcomm and Wuqi chips , supporting applications such as 2T2R, dual-band, and SDIO. The underlying industry logic is very clear: Chip manufacturers provide the connectivity platform, while module manufacturers are responsible for truly transforming chip capabilities into end-user, mass-producible, and certifiable products. Future module platforms may simultaneously possess: Wi-Fi + Bluetooth + Thread/802.15.4 + AI computing + Sensing Wireless modules are evolving from "a communication device" to "a smart connectivity platform". 9. QOGRISYS: Extending from Wi-Fi modules to multi-scenario wireless connectivity capabilities For terminal equipment manufacturers, standard upgrades are only the first step. Real product development also needs to consider: Performance, size, power consumption, interface, antenna, radio frequency, operating system, certification, and mass production cost. This is also the key value of QOGRISYS's long-term strategic layout in wireless communication modules. In terms of product portfolio, QOGRISYS has formed a product layout that includes Wi-Fi modules, Bluetooth modules, Wi-Fi HaLow, NearLink, PLC modules, and IoT/AIoT modules , covering application areas such as artificial intelligence, smart home, industrial internet, consumer digital products, telemedicine, and new energy. Regarding Wi-Fi 7 products, O2072PB, O2072PM, and other products are currently listed on the O2072PB/O2072PM product page. Among them, O2072PB/O2072PM are labeled as 802.11be + Bluetooth 6.0, 2T2R, and 5.8Gbps . This means that there is a relatively direct correspondence between QOGRISYS's product roadmap and industry trends: Wi-Fi 7 → High-performance wireless connectivity Bluetooth 6.0 → Low-Power Connectivity and Spatial Awareness AIoT → Local Intelligence and Edge Computing PLC → Energy and Industrial IoT Communication Multi-protocol → Converged connectivity for complex terminal scenarios Therefore, a more complete connectivity technology chain is being formed, from chips to modules, and then from modules to end applications. 10. The true value of Wi-Fi 7 lies in making the connection between smart devices more reliable. If you look at the development of the entire industry together, you'll find that the significance of Wi-Fi 7 is changing. Wi-Fi 4 era: Solve the problem of "Is there a wireless network?". The Wi-Fi 5 era: Solve the problem of "Is the wireless network fast enough?" Wi-Fi 6 era: How to solve the problem of "many devices connecting to the network at the same time". Wi-Fi 7 era: The task began by addressing how to maintain reliable connections in high-performance, multi-device, low-latency, and complex network environments. The AIoT era has raised new questions: The device not only needs to be connected to the network, but also needs to sense, compute, coordinate, and make autonomous decisions. Therefore, Wi-Fi 7 is just the starting point of this change. The real next stage is: Wi-Fi + Bluetooth + Thread/Matter + AI + Sensing + Edge Computing Together, they form the connection base for the next generation of smart terminals.