Quality WiFi7 Module & WiFi HaLow Module Manufacturer

  On December 10, Qualcomm announced the completion of its acquisition of Ventana Micro Systems, further strengthening its technological footprint in the RISC-V architecture and high-performance computing fields. The global leading chip and wireless connectivity platform supplier Qualcomm announced it has officially completed the acquisition of Ventana Micro Systems. As a leader specializing in high-performance RISC-V architecture, the addition of Ventana will significantly enhance Qualcomm's computing power layout for the AI era, heterogeneous computing architecture design capabilities, and open ecosystem building capabilities, providing a stronger underlying foundation for future smart terminals, industrial equipment, and edge computing systems. Architecture Capabilities, Accelerating Heterogeneous Computing Innovation As demands for AI inference, local computing, security isolation, and low-power processing continue to rise, the requirements for CPU scalability and energy efficiency in terminal devices are constantly increasing. Ventana specializes in scalable RISC-V compute chiplets, and its team is deeply involved in advancing open instruction set standards, which will provide Qualcomm's Oryon CPU architecture with further room for architectural innovation. Qualcomm stated that the new team will collaborate with the existing CPU R&D department to promote the development of more versatile, efficient, and open processor capabilities for future mobile terminals, XR, automotive electronics, industrial equipment, and AI edge nodes. Enhancing System-Level Design Capabilities, Expanding Future SoC Product Roadmap With the integration of Ventana's technology, Qualcomm's future SoC architectures will possess stronger modular expansion capabilities, enabling more efficient coordination among processors, DSPs, AI engines, and connectivity subsystems. The company stated that this move will significantly enhance its competitiveness in fields such as data center edge, industrial control, and high-efficiency computing, and will attract more partners through a more open RISC-V ecosystem, promoting the standardization of next-generation system platforms Driving Industry Collaboration with an Open Ecosystem, Providing More Flexible Technological Paths for Terminal Devices Ventana's entry not only completes a key piece of Qualcomm's puzzle in the RISC-V ecosystem but also means that future OEMs, ODMs, and IoT device manufacturers will have access to more open and customizable reference architectures. With more controllable core IP, a more transparent ecosystem model, and a more efficient computing power structure, Qualcomm hopes this strategic move will accelerate the iteration of various smart devices in terms of security, energy efficiency, and local intelligent processing. Integrating Industry Chain Innovation, Accelerating Next-Generation Wireless Terminal Development As computing power and architectural capabilities improve, the demand for wireless connectivity in next-generation terminals is also upgrading. To ensure stable device performance in high-density, low-latency, multi-link environments, QOGRISYS has launched the O2072PM tri-band Wi-Fi 7 + Bluetooth 6.0 module based on the Qualcomm platform. This module features deep optimizations on 320MHz, 4K QAM, eMLSR multi-link, and Qualcomm's advanced RF architecture, enabling more reliable high-bandwidth connections in homes, industrial settings, campuses, and smart devices. With its compact packaging and PCIe design, the O2072PM provides terminal manufacturers with a quickly mass-producible, stable-performance, future-ready Wi-Fi 7 connectivity foundation.  

Amid accelerating convergence between AI and wireless technologies, LitePoint hosted its annual technical seminar in Hsinchu and Taipei in September 2025 under the theme “Intelligent Connectivity Without Boundaries: Test-Driven Innovation.” As a global leader in wireless test solutions, LitePoint highlighted key challenges of the multi-technology era and showcased advances in Wi-Fi 8, 5G RedCap, Bluetooth 6.0, UWB, and optical communication testing. Figure 1. Glenn Farris, Global Vice President of Sales, LitePoint   Multi-Technology Convergence as a Core Industry Trend The event began with remarks from Glenn Farris, LitePoint’s Vice President of Global Sales, who emphasized that expanding wireless applications and increasingly complex deployment environments are placing higher demands on testing systems. Adam Smith, Vice President of Marketing, noted that AI-driven wireless innovation is moving toward multi-technology collaboration, where 5G RedCap, Wi-Fi, Bluetooth, and UWB will coexist and complement one another. Security, stability, and interference resistance will be essential competitive factors for future devices.   Smith added that while 6G development remains cautious, 5G FWA is rapidly expanding globally. Meanwhile, mid- and high-end devices are upgrading to Wi-Fi 7, laying the foundation for Wi-Fi 8. Wireless experience metrics will shift from being speed-centric to prioritizing low latency, high reliability, and coordinated multi-device operation.   Wi-Fi 8: From High Speed to High Reliability A MediaTek representative detailed four major enhancements coming with Wi-Fi 8: Enhanced Long Range (ELR), Coordinated Spatial Reuse (Co-SR), Dynamic Subchannel Operation (DSO), and Non-Primary Channel Access (NPCA). These features aim to strengthen Wi-Fi performance in crowded, high-interference environments. ELR improves connectivity at greater distances; Co-SR enhances efficiency in multi-router Mesh deployments; and NPCA improves link stability under heavy interference. MediaTek expects Wi-Fi 8 to become foundational for home, enterprise, and industrial scenarios, supported by LitePoint’s comprehensive testing ecosystem.   Optical Communication and CPO Rising AI compute demands are accelerating bandwidth growth in data centers, making optical communication a key topic at the seminar. Quantifi Photonics presented parallel testing solutions for silicon photonics and co-packaged optics (CPO). With 800 Gbps and 1.6 Tbps modules entering mass production, full-chain testing from wafer to finished system is becoming increasingly critical. Quantifi demonstrated multi-channel automated testing on a PXI platform, emphasizing its importance for large-scale optical module manufacturing.   Bluetooth 6.0, UWB, and RedCap: Joint Evolution of Multi-Radio Technologies The seminar also highlighted advancements in Bluetooth 6.0, UWB 802.15.4ab, and 5G RedCap. Bluetooth 6.0 enables sub-meter precision for tracking and indoor navigation; UWB’s new narrowband auxiliary link enhances long-distance stability; and 5G RedCap/eRedCap supports wider IoT adoption with lower power consumption and costs. LitePoint’s IQxel, IQgig, and IQcell platforms support comprehensive testing for these technologies. Figure 2. Zhiwei Huang, Deputy Director of Applications Engineering, LitePoint   IIoT and Edge AI: New Opportunities Through Industry Collaboration A roundtable discussion explored the integration of IIoT and edge AI. Experts noted that high-reliability wireless connectivity is becoming essential for AMR robots, smart warehousing, medical systems, and urban infrastructure. Wi-Fi 7, 5G RedCap, GNSS, and UWB together form the communication backbone for next-generation intelligent devices. Mature testing platforms will be key to enabling large-scale deployment.   As multi-technology collaboration deepens, wireless capability is becoming a core device attribute. Whether it is Wi-Fi 8’s high reliability or Wi-Fi 7’s rapid adoption, the ability of devices to evolve with network upgrades will be crucial. Device manufacturers are now asking: in complex, high-concurrency environments, what wireless foundation is needed for devices to fully leverage next-generation networks?   QOGRISYS is advancing its Wi-Fi 7 module development using LitePoint’s MX Wi-Fi 7 test platform. The new O2072PM and O2072PB tri-band Wi-Fi 7 + Bluetooth 6.0 modules provide optimized 320 MHz bandwidth, eMLSR multi-link performance, 4K QAM, and CSI sensing. These features enhance performance in high-density and low-latency environments. With a compact design and PCIe interface, O2072PM integrates easily into smart devices, industrial equipment, and IoT nodes, providing a strong foundation for the transition into the Wi-Fi 7 era.    

Figure1: WAA Presents the WLAN Integrated Sensing and Communication Excellent Case Certificate to Huawei The "Digital-Intelligent Campus Innovation Practice Meetup", focused on network experience upgrades and intelligent innovation for office campuses, concluded successfully at Huawei's Nanjing Research Institute. Industry organizations, enterprise customers, and ecosystem partners gathered on-site for in-depth exchanges on new campus network technologies, architectures, and scenarios, and experienced a series of innovative implementations such as smart meeting rooms, inspection care, asset inventory, and AI navigation. Notably, the Huawei Nanjing Research Institute AI Integrated Sensing and Communication Smart Campus (hereafter referred to as "AI Digital-Intelligent NRI") was successfully selected as the "WLAN Integrated Sensing and Communication Excellent Case" by the World Wireless LAN Application Development Alliance (WAA). Latest Network Technologies First Applied to Own Campus, Creating a "Replicable" Future Campus Model In his speech, Zhao Shaoqi, President of the Campus Network Domain, Data Communication Product Line at Huawei, stated that Huawei consistently prioritizes applying the latest technologies to its own campuses, adhering to the practical spirit of "testing one's own parachute first" to create a benchmark model for the industry to reference. The "AI Digital-Intelligent NRI" project is precisely based on this philosophy. By integrating "Wi-Fi + Sensing" and "Wi-Fi + IoT" capabilities, it infuses powerful intelligence and visualization capabilities into the 10 Gigabit campus network, setting a new direction for digital-intelligent upgrades for industry customers. WAA: Excellent Case Provides Demonstrative Value for Global Campus Network Construction WAA Secretary-General Yang He pointed out that the alliance continuously promotes global WLAN industry innovation, supporting campus network construction through white papers and evaluation methodology systems. The emergence of cases like "AI Digital-Intelligent NRI" provides the industry with a high-quality reference model that can be promoted top-down, accelerating the large-scale application of integrated sensing and communication technology in smart campuses. Deep Integration with Business Scenarios, Driving Campuses Towards "Fully Digital, Fully Perceptive, Fully Intelligent" In a keynote speech, Lu Xin, Vice President of Huawei's IT Platform Service Department, shared the construction philosophy of "AI Digital-Intelligent NRI". Centered around typical scenarios like office work, access, inspection, and security, the project leverages Huawei's Galaxy AI 10 Gigabit Campus Network and HIS Digital Operating System. Through digital element aggregation, AI governance, and scenario-based applications, it achieves a comprehensive improvement in employee office experience and enables more efficient, real-time intelligent operational capabilities for the campus. Chen Jiefu from the Shanghai Institute of Architectural Design & Research also shared his experience in intelligent building renovation for urban structures. He mentioned that in the Shanghai Design Mansion project, Huawei's 10 Gigabit Campus Office Network Solution was adopted. The All-Optical Ethernet architecture and Wi-Fi 7 Integrated Sensing and Communication technology together built a stable wireless foundation, enabling the building to achieve a genuine digital advancement. AI-Driven Network Evolution, Achieving "Dual Upgrade" in Operations and Experience Chen Yongxing, Vice President of the Campus Network Domain, Data Communication Product Line at Huawei, emphasized that the introduction of AI has significantly enhanced campus network security, application performance, wireless experience, and operational management. Huawei aims to create a campus network foundation characterized by high stability, high intelligence, and high operational efficiency for its customers through deep synergy between technology and business. The "Tiangang Laboratory" open house on the day allowed attendees to deeply experience the real-world application results of integrated sensing and communication capabilities in office scenarios. For example, using CSI sensing technology to enable smart meeting room features like "lights on when people enter, off when they leave" and "automatic release when unoccupied"; achieving precise security inspections at night by sensing human figures; enabling automatic asset inventory in warehouses, significantly reducing loss probability; realizing visual, self-optimizing, and intelligent diagnosis full-process operations through iMaster NCE and the AI Network Agent; and the AI navigation function enabling meter-level precise location of office resources, bringing great convenience to large-campus work. Figure2 Chen Yongxing, Vice President of the Campus Network Domain, Data Communication Product Line at Huawei This series of achievements not only demonstrates the maturity and replicability of integrated sensing and communication technology but also reflects the crucial transition of campus networks from "connectivity" to "intelligence". Looking Forward: O2072PM Empowers More Smart Campus Devices Towards Wi-Fi 7 As campus networks rapidly evolve from "high-bandwidth" to "intelligent sensing" and "multi-service integration", various terminal devices are also moving towards higher performance, lower latency, and stronger sensing capabilities. In response to this trend, QOGRISYS introduces the O2072PM Tri-Band Wi-Fi 7 + Bluetooth 6.0 Module, providing more flexible and powerful wireless foundational capabilities for the new generation of smart campus terminals. The O2072PM adopts a tri-band architecture and supports key Wi-Fi 7 features such as 320MHz bandwidth, eMLSR multi-link operation, 4K QAM, and CSI sensing. It can deliver more stable and controllable connection experiences in high-density offices, smart inspection terminals, indoor positioning devices, and general IoT equipment. Its compact package design allows various campus terminals to integrate Wi-Fi 7 capability with lightweight design, accelerating the large-scale deployment of "smart scenarios + wireless sensing" technology and bringing higher value to smart campus construction.