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I. The "Impossible Triangle" of IoT Terminals With the rapid iteration of IoT terminals, more and more devices are moving towards miniaturization and battery power, while products are facing design challenges such as limited PCB space, insufficient battery life, and unstable wireless connectivity . This is not an isolated phenomenon in a particular sub-sector, but rather a systemic challenge facing the entire Internet of Things (IoT) industry. In 2026, global shipments of wireless modules reached 870 million units, with a market size exceeding US$41.2 billion. By 2030, global shipments are projected to climb to 1.52 billion units, with a CAGR of 11.8%, and the market size is expected to reach US$79.8 billion. During the same period, the number of connected IoT devices worldwide is expected to exceed 39 billion. This explosive growth in device numbers is amplifying the challenges of every design dimension into key factors determining product success or failure. Small size, low power consumption, and high stability—these three requirements are forming the "impossible triangle" in IoT terminal design. In traditional solutions, these three often constrain each other: pursuing small size limits antenna performance, pursuing low power consumption sacrifices transmission rate, and pursuing stability increases power consumption and size. Finding a balance among these three has become a core issue for module solution providers. II. Challenge 1: Extremely tight PCB space Industrial driving force of space compression From smart rings and TWS earphones to micro sensors and smart locks, the physical space of terminal devices is being continuously compressed. The micro battery market is projected to grow from $1.59 billion in 2025 to $1.81 billion in 2026, representing a CAGR of 13.5%. This rapid growth in the micro battery market is a direct reflection of the trend towards device miniaturization —the smaller the device, the higher the requirements for battery volume and energy density. One of the most challenging problems faced by hardware engineers is achieving high-density, high-stability electrical connections between the daughterboard and the motherboard under extremely limited overall device thickness and PCB space. As an indispensable radio frequency component in the device, the footprint of the wireless module directly determines the feasibility of the overall device layout. Solution path for miniaturized modules The industry is addressing the spatial challenges from multiple perspectives. The O9101SA module from Qogrisys has compressed its size to 12×12mm , while supporting dual-band Wi-Fi 6 and BLE 5.4 with speeds up to 600Mbps . This size is among the industry-leading levels for Wi-Fi 6 + Bluetooth Combo modules. This extreme size reduction not only allows for more space to be packed in, but also frees up valuable PCB space for other components such as the battery, sensors, and main control chip – the smaller module footprint allows for more storage . Multi-protocol single-chip integration is another key path. Two independent modules, plus their respective peripheral circuits and antenna clearance, occupy a much larger PCB area than a single multi-protocol integrated module. In small-sized products such as smart bulbs and panel switches, this area is the biggest limiting factor. The Wi-Fi/Bluetooth Combo solution fundamentally reduces PCB footprint by integrating the two protocols into a single chip. The area occupied by antennas is also significant. Traditional antenna implementations consume 15%-25% of the total PCB area in mobile devices and IoT applications. The emergence of antenna-in-package (AiP) technology integrates the antenna into the module package, achieving space savings of 40%-60% . Challenge 2: Severely Inadequate Battery Life The Economics of Range Anxiety For battery-powered IoT devices, battery life is not a "nice-to-have" but a "life-or-death" issue. The global IoT battery market was valued at $15.9 billion in 2024 and is projected to grow to $36.88 billion by 2033, representing a CAGR of 9.8%. This continued expansion reflects the rigid demand from end devices for longer battery life. The operational lifespan of battery-powered nodes directly impacts maintenance costs and deployment scalability . The industrial value of low power consumption technology The low-power Wi-Fi module market is projected to reach $4.142 billion in 2025 and $11.79 billion in 2032, representing a CAGR of 16.4%. The BLE module market is expected to grow to $68.27 billion in 2032, with a CAGR of 13.80%. The robust growth of these two segments confirms that low power consumption has become one of the most crucial competitive dimensions in the module industry. IV. Challenge 3: Unstable wireless connection Crowded 2.4GHz and limited antennas The root cause of unstable wireless connections lies in two structural contradictions. The first problem is frequency congestion. The 2.4GHz ISM band is shared by multiple protocols such as Wi-Fi, Bluetooth, Zigbee, and Thread, resulting in severe co-channel interference. In high-density deployment scenarios such as smart homes and offices, signal conflicts and data rate degradation are commonplace. The second contradiction is the limitation of antenna performance. Device miniaturization means that the available space for the antenna is compressed, and the antenna efficiency and bandwidth decrease accordingly. There is an inherent physical constraint between radio frequency performance and device size —the smaller the antenna size, the lower the radiation efficiency, and the worse the communication distance and stability. V. Qogrisys Systemic Solutions To address the aforementioned triple design challenges, QOGRISYS offers a comprehensive product portfolio, providing end-to-end solutions from chips to modules and from hardware to software. Extremely Miniaturized Product Matrix Qogrisys has achieved complete coverage in the field of small-sized modules, from Wi-Fi 6 to Wi-Fi 5, and from Combo to single Wi-Fi. The O9101SA boasts a compact size of 12×12mm , supports dual-band Wi-Fi 6 and BLE 5.4 with speeds up to 600Mbps, and utilizes an SDIO 3.0 interface . It supports a 2.4GHz/5GHz dual-band simultaneous (DBS) architecture , uplink/downlink MU-OFDMA and MU-MIMO, and BT/BLE dual-mode operation . The O9101SA, along with the O9101UE and O9101UD, belongs to the Oufixin 1×1 Wi-Fi 6 module series developed based on the WQ9101 chip . The O9101UE measures 13×12.2mm and uses a USB 2.0 interface; the O9201SB measures only 13×15mm, is also based on the WQ9201 chip, and offers speeds up to 1200Mbps. The O9201UB shares the same platform as the O9201SB and uses a USB 2.0 interface. The O8852PB measures 13×15mm, is based on the Realtek RTL8852BE chip, supports Wi-Fi 6 and Bluetooth 5.2 with a speed of 1200Mbps, and uses a PCIe interface. For scenarios with stricter space constraints, the small size of these modules is particularly advantageous. The smaller module footprint frees up valuable PCB space for other components such as the battery, sensors, and main control chip. Low-power design: Co-optimization from chip to system Qogrisys's low-power capability stems primarily from the selection and deep collaboration with upstream chips. The Wuqi WQ9201 chip, with its stable transmission performance and internationally leading low-power consumption , stood out from 364 products from 280 chip companies, winning the 2024 "China Chip" Excellent Technological Innovation Product Award. Interference Resistance and Stable Connection: Breakthrough Technologies in Dual-Band and Multi-Protocol Integration O9201SB, O9101UE , and O8852PB all support 2.4GHz/5GHz dual-band Wi-Fi 6. The core value of the dual-band architecture lies in "selectivity"—when the 2.4GHz band becomes congested due to the coexistence of protocols such as Bluetooth and Zigbee, the device can switch to the 5GHz band to ensure transmission speed and connection stability. Dual-band Wi-Fi 6 also brings core technologies such as OFDMA and MU-MIMO, improving spectrum utilization efficiency in scenarios with multiple concurrent devices. In high-density deployment environments such as smart homes and offices, these technologies directly translate into improved user experience—lower latency, fewer dropped connections, and more stable connections. Multi-protocol integration is another approach. A single module can simultaneously support multiple protocols such as Wi-Fi, Bluetooth, Zigbee, and Thread, and can intelligently select the best connection method according to the environment, flexibly switching between different scenarios. VI. Industry Outlook: From "Usable" to "Effective" Looking ahead to 2026-2032, the design trend for small-size, low-power modules will continue to evolve along the following directions: First, the limits of size will continue to be broken . The competition for module size is far from over, and the approach of physical limits is forcing continuous innovation in packaging technology. Secondly, low power consumption will shift from a "feature" to a "standard feature." QYResearch data shows that the low-power Wi-Fi module market will continue to expand at a compound annual growth rate of 16.4%. Low power consumption will no longer be a differentiating selling point for high-end modules, but rather a basic requirement for all module products. Third, multi-protocol integration, miniaturization, and low power consumption will be deeply intertwined. Integrating multiple protocols such as Wi-Fi, Bluetooth, Zigbee, and Thread onto a single chip is a fundamental solution to the space and power consumption issues. The widespread adoption of the Matter protocol will further strengthen this trend— future modules will no longer require users to "select" protocols, but will automatically adapt to the optimal connectivity solution based on the environment and application. Fourth, module selection is evolving from "component procurement" to "strategic decision-making." Under the dual constraints of miniaturization and low power consumption, module selection is no longer merely a comparison of technical parameters, but a strategic choice concerning product definition, development cycle, and time-to-market. A suitable module solution can compress the development cycle from months to weeks and simplify a four-layer PCB to a two-layer PCB .  

By 2026, edge AI will no longer be a concept that needs to be "defined," but a reality that is being "quantified"—and the speed and scale of this quantification far exceed the expectations of most analysts a year ago. Edge AI is moving from "proof of concept" to "large-scale deployment." I. Qualcomm's Strategic Move: Dragonwing Dual-Processor Chip Released to Boost Edge AI On the eve of the 2026 IFA Berlin, Qualcomm officially launched two processors , the Dragonwing Q-2390 and IQ-2390. The Q-2390 highly integrates edge AI inference, cellular connectivity, positioning, and display support into a single chip, aiming to lower the development threshold for edge AI devices. The IQ-2390 focuses on enhancing machine vision acceleration, TSN (Time-Sensitive Networking) support, and has a wide operating temperature range of -30°C to +115°C , designed for demanding scenarios such as industrial automation, machine vision, and energy management. Qualcomm's core intention in this announcement is to reduce the complexity of implementing edge AI in industrial scenarios through chip-level integration and industrial hardening. II . Edge AI Market: A Trillion-Dollar Track Accelerating The market size of edge AI is expanding at an astonishing rate. According to a recent report by Global Market Insights, the global edge AI market is valued at approximately $25.2 billion in 2025, projected to reach $30.9 billion in 2026, and is expected to grow to $225.5 billion by 2035, representing a compound annual growth rate (CAGR) of 24.7% from 2026 to 2035. Data from Mordor Intelligence also corroborates this trend: the edge AI hardware market is projected to grow from $25.08 billion in 2025 to $30.74 billion in 2026, reaching $68.73 billion in 2031 . The global edge AI market (hardware + software + services) is approaching $47-50 billion in size by 2026, with a year-on-year growth rate exceeding 28% . IDC predicts that the overall edge computing market will reach $450 billion by 2029, with AI being the primary growth engine . From a regional perspective, the Asia-Pacific region is the fastest-growing edge AI market globally . China, as a core growth engine, leads the world in shipments of edge devices equipped with domestically produced computing chips. Bulk procurement in areas such as smart security, smart cities, and factory automation continues to drive demand, with the domestic market growing at an annual rate exceeding 34% . III . The AI-driven transformation of the module industry: From "connectivity" to "computing + connectivity" The explosive growth of the edge AI market is profoundly reshaping the competitive logic of the module industry. Traditional module manufacturers heavily rely on the number of connections and shipment growth, but this model is encountering bottlenecks. In the first quarter of 2026, shipments of AI embedded cellular IoT modules declined by 17% year-on-year, marking the first decline after 12 consecutive quarters of growth in the market. The penetration rate of AI modules in global cellular IoT modules is currently only about 6%—meaning that edge AI modules are still on the verge of explosive growth, rather than a red ocean market . Meanwhile, leading companies in the industry are accelerating their transformation towards "connectivity + intelligence." Quectel Wireless Solutions' revenue in the first half of 2026 reached RMB 15.259 billion, a year-on-year increase of 32.16%, with automotive, intelligent, and solutions businesses accounting for 46.76% of revenue. Furthermore, the gross profit margin of this segment (21.42%) is significantly higher than that of traditional communication module businesses (16.28%) . Andrew Zignani, Senior Research Director at ABI Research, pointed out that wireless connectivity is no longer just about connecting devices; it's also about enabling scalable edge AI in consumer, enterprise, and industrial markets . IV . Trends in Module Products Driven by Edge AI The large-scale deployment of edge AI is reshaping the definition of module products from three dimensions. Trend 1: From "Communication Modules" to "Computing Modules" . The integration of AI edge computing chips has become the core differentiator for modules in 2026. Shipments of modules supporting edge inference exceeded 80 million units in 2025, and this proportion is expected to rise to 35% of total module shipments by 2030. The compound annual growth rate of high-performance computing modules is projected to reach 60% over seven years, and the proportion of intelligent and AI modules in cellular IoT modules will continue to increase. Trend Two: Industrial-grade wide operating temperature range becomes the "entry ticket ." Wide operating temperature capability reflects the stringent reliability requirements of modules in industrial edge AI scenarios. Industrial-grade modules typically require an operating temperature range of -40℃ to +85℃. In scenarios such as oil and gas, power, and outdoor infrastructure, wide operating temperature capability directly determines whether the equipment can operate stably in real-world environments. Trend 3: Multi-technology integration becomes standard . Edge AI scenarios often require simultaneous support for multiple connectivity methods—industrial automation needs Wi-Fi/Bluetooth for inter-device communication, energy management needs PLCs to solve the problems of transmission through walls and over long distances, and industrial gateways need cellular networks to upload data to the cloud. Modules with single communication methods are being replaced by integrated solutions that combine multiple modes . V. Qogrisys's Product Strategy: AI Capabilities Connected to the Base Amid the industry wave of module manufacturers moving towards AI, QOGRISYS's strategic path clearly demonstrates the industry logic of integrating "connectivity + computing". Qogrisys's strategic path can be summarized as follows: using high-speed connectivity as the foundation and edge AI as the incremental factor, to build an intelligent module product matrix covering multiple scenarios. Wi-Fi 7 Module: Full Product Lineup In the Wi-Fi 7 field, O2072PM and O2072PB, two Wi-Fi 7 + Bluetooth 6.0 combo modules based on the Qualcomm QCC2072 chip, fully support 4K QAM, 320MHz channels, MLO (Multi-Link Operation), with a peak rate of 5.8Gbps and eMLSR enhanced multi-link switching. The O2072PM uses an M.2 Key E interface (22×30mm), making it suitable for high-end robots and industrial equipment. From an industry trend perspective, Wi-Fi 7 is rapidly entering a large-scale deployment phase. IDC data shows that in the first quarter of 2026, Wi-Fi 7 already accounted for 44.5% of global enterprise WLAN-dependent AP revenue. The growth of Wi-Fi 7 is no longer limited to routers and enterprise APs; IoT devices are becoming an important source of growth in the next stage . Multi-platform and multi-scenario coverage Qogrisys's core R&D team has long been deeply involved in mainstream global wireless chip platforms such as Qualcomm, Realtek, and MediaTek, accumulating full-stack experience from chip bring-up and RF calibration to mass production testing . This multi-platform, full-stack technical capability enables Qogrisys to provide compatible connectivity solutions across different customers' main control solution ecosystems. In terms of application scenarios, Qogrisys's product matrix has extended to multiple core areas of edge AI: industry and intelligent manufacturing , modules such as O9201PM have completed driver adaptation and full verification on domestic platforms such as RK3588, Allwinner, and Rockchip, and can be widely used in scenarios such as industrial tablets, edge computing gateways, industrial control equipment, smart retail terminals, and digital signage. robotics and embodied intelligence , the ultra-high bandwidth and ultra-low latency provided by Wi-Fi 7 form an invisible infrastructure for cloud-edge-device collaboration—robots upload sensor data to edge servers in real time for VLA model inference, receive decision commands, and execute them instantly. Qogrisys's Wi-Fi 7 module product line already covers the needs of high-end robots and industrial equipment. VI. Trend Analysis: Three Certain Directions for Edge AI Modules Based on Qualcomm's chip release trends, three definite trends can be identified in the field of edge AI modules: First, AI capabilities will become a standard feature rather than an optional feature for modules. As the report "Edge Intelligence 2026: The First Year of Large-Scale Deployment" points out, 2026 has become a crucial turning point for edge intelligence, moving from proof-of-concept to large-scale deployment. The market space for pure connectivity modules lacking AI acceleration capabilities will continue to shrink. The seven-year compound annual growth rate of intelligent modules and AI modules reached 60% and 28% respectively , and this difference in growth rate is the strongest evidence of this. Second, industrial scenarios represent the most certain high-value market for edge AI modules. The industrial AI accelerator chip market is expanding at an average annual growth rate of 40%. Industrial visual inspection is migrating from traditional algorithms to deep learning, and predictive maintenance is generating explosive demand for edge inference computing power. Third, the convergence of "connectivity + computing" modules will become the infrastructure of the AIoT era. Wi-Fi 7 provides a connection base with ultra-low latency and ultra-high throughput, while edge AI provides localized intelligent decision-making capabilities. When the coverage density of Wi-Fi 7 and the computing power density of edge AI converge at the device end, the module will be upgraded from a "communication component" to an "intelligent computing node".    

On August 31, 2026, a report by CCTV Finance shook the entire semiconductor industry. According to industry research data, the demand for domestically produced AI chips in 2026 was approximately 4 million units, while actual deliveries were only around 3 million units, leaving a capacity gap of millions . Some high-end computing power companies already had orders booked three years into the future .   What is the connection between this "computing power famine" in the cloud computing field and the Wi-Fi, Bluetooth, and PLC modules shipped every day? The answer lies hidden in three transmission paths. I. Three transmission paths of computing power shortage Path 1: Structural shortage of memory chips The insane demand for high-bandwidth memory (HBM) from AI servers is reshaping the global DRAM supply landscape. Memory manufacturers are prioritizing capacity for the more profitable AI-grade HBM while cutting production of traditional memory chips such as LPDDR4 . According to TrendForce data, traditional DRAM contract prices rose by 90% to 95% quarter-on-quarter in the first quarter of 2026. Entering the second quarter, general DRAM contract prices continued to rise by 58% to 63% quarter-on-quarter, while NAND Flash contract prices rose by 70% to 75% . Changxin Memory Technologies, a leading memory chip company, reported revenue of 150.3 billion yuan in the first half of the year, a staggering 873.64% year-on-year increase. For Wi-Fi and Bluetooth modules that require the integration of DRAM and Flash, this means that the BOM cost is systematically increased . Path Two: Cost Resonance Across the Entire Industry Chain The surge in demand for AI chips has not only driven up storage prices but has also triggered a chain reaction of price increases across the entire industry chain. On July 1, 2026, ASE Technology Holding Co., Ltd., the world's leading semiconductor packaging and testing supplier, announced another round of price increases for its packaging products, with the highest increase exceeding 20% , primarily targeting advanced packaging categories such as CoWoS and FoCoS . There is still approximately a 10% supply-demand gap in advanced packaging technologies . From components such as crystal oscillators, PCBs, MLCCs, and inductors, to semiconductor stages such as chip packaging and testing, substrates, and silicon wafers, rising costs are passed down through each stage to the module stage. The BOM cost of each Wi-Fi/Bluetooth module is passively increasing . Path Three: The "Siphoning Effect" of Production Capacity AI chips are not only consuming advanced process capacity, but also taking up a large amount of mature 8-inch wafer capacity. Wafer fabs and packaging and testing plants are prioritizing capacity for high-profit AI computing power orders, squeezing the capacity of IoT chips. Yole projects the 2.5D/3D advanced packaging market to reach nearly $35 billion by 2030. Industry experts generally anticipate that the tight supply and demand situation for advanced packaging will continue . Counterpoint predicts that the average selling price of cellular IoT modules will face upward pressure in the second half of 2026 , primarily due to the continuously rising cost of memory . This means that the production capacity of IoT chips such as Wi-Fi and Bluetooth may face long-term pressure, with tight supply and extended delivery times becoming the norm. II. A Tale of Two Extremes: Industry Differentiation Amidst Computing Power Shortages The "Ice" Side: Short-Term Pain The most direct impact of the AI chip shortage on the module industry has already begun to appear in the data. According to a report released by Counterpoint Research, shipments of embedded AI cellular IoT modules declined by nearly 17% year-over-year in the first quarter of 2026 , marking the first decline after 12 consecutive quarters of growth . In 2025, this category maintained a year-over-year growth of 19% . As memory costs rise, the average selling price of embedded AI cellular modules has increased by double digits , forcing module manufacturers to raise prices. Ultimately, the increase in hardware costs has affected demand across various application areas . Meanwhile, global shipments of cellular IoT modules grew by only 4% year-on-year in the first quarter of 2026 , marking the first time they had fallen to single digits after seven consecutive quarters of double-digit growth . Shipments in the Chinese market declined by 2% year-on-year in the same quarter . The "Fire" Side: Long-Term Opportunities However, short-term cost pressures have not changed the industry's long-term direction. A report by Shanxi Securities points out that IoT modules are evolving from basic communication functions towards high computing power and intelligence. Counterpoint Research predicts that by 2030, the penetration rate of artificial intelligence in cellular modules will reach 25% . "Artificial intelligence will no longer be limited to a few niche applications, but will become a standard feature." In the Wi-Fi sector, the global Wi-Fi module market size is projected to reach $16.82 billion in 2026, representing a year-on-year growth of 17.9% . The market share of Wi-Fi 7 modules will rapidly climb to 17.2%, with an estimated 234 million units shipped throughout the year . IDC data shows that in the first quarter of 2026, Wi-Fi 7 already accounted for 44.5% of global enterprise WLAN AP revenue, a significant increase compared to 11.8% in the first quarter of 2025. The Wi-Fi Alliance predicts that global Wi-Fi 7 device shipments will reach approximately 1.1 billion units in 2026 . III. The Response Logic of Module Manufacturers: From "Passive Pressure" to "Proactive Breakthrough" Faced with the cost impact across the entire industry chain caused by the shortage of cloud AI chips, Shenzhen Qogrisys has transformed external pressure into an upgrade impetus through its contingency strategies: On the supply chain side , we have established deep ecological collaborations with chip manufacturers such as Qualcomm, Realtek, Wuqi, and HiSilicon, upgrading the procurement relationship to a "joint development + capacity lock-in" model, so as to ensure supply stability during periods of tight capacity through large-scale operations and long-term cooperation. On the product side , the company aims to mitigate risks through full-scenario coverage. The Wi-Fi 7 module (O2072PM/ O2072PB ) is positioned to capitalize on the next-generation high-speed connectivity window, the PLC module (3121N-H/S130N-ISI) serves as a cost "ballast" with low storage dependence, and the domestic innovation module (O9201SB/O9201PM) enters the 2.66 trillion yuan domestic substitution market. At the same time, the company is also developing cutting-edge technologies such as Wi-Fi HaLow and AIoT modules. On the service side , the company is shifting from "selling standard products" to "selling deeply customized solutions," enhancing customer loyalty with a complete hardware platform foundation and full-chain technical services. On the compliance side , products have obtained certifications from multiple countries, including FCC, CE, and SRRC, circumventing trade barriers. This cost shock caused by the shortage of AI computing power is accelerating the weeding out of weaker players in the module industry, while deep ecosystem collaboration, a full-scenario product matrix, and customized service capabilities are becoming the core barriers for module solution providers to weather the cycle. IV. The "Safe Haven" Effect of PLCs In this round of AI chip shortages, PLC (Power Line Carrier) modules are relatively less affected . PLC modules have a lower reliance on high-bandwidth memory, unlike high-end Wi-Fi/Bluetooth modules which require the integration of large-capacity DRAM and Flash. PLC main control chips mostly use mature manufacturing processes, and although they also face some capacity constraints, the extent is far less than that of AI-related chips. In major PLC application scenarios such as smart lighting and smart homes, the requirements for real-time performance and stability are higher than computing power, and the impact of the AI chip price surge is relatively indirect. When Wi-Fi/Bluetooth modules face a comprehensive cost increase, PLC modules become a relatively cost-effective and stable connection solution. V. From “Selling Connectivity” to “Selling Connectivity + Computing”: A Paradigm Shift in the Module Industry This computing power shortage reveals a deeper industry trend: the module industry is moving from "single connectivity" to comprehensive competition involving "connectivity + computing + ecosystem". According to data from IoT Analytics, the number of connected IoT devices worldwide reached approximately 21.1 billion in 2025 and is projected to reach approximately 39 billion by 2030. This increase in the number of devices is only the first layer of change; more importantly, an increasing number of IoT devices are beginning to possess AI algorithms, NPUs, local inference, voice interaction, and edge computing capabilities . This means that the amount of data generated and processed by terminal devices is constantly increasing, which places higher demands on wireless modules— not only to "transmit faster", but also to "calculate closer and connect more stably" . VI. Conclusion While everyone is chasing the "brain" of computing power, even the most powerful brain needs a sensitive "neural network" to perceive the world and transmit instructions. Wireless modules are an indispensable neural network in this AI era. As CCTV Finance reported, the underlying reason for this round of growth is not just passive price increases due to "shortage," but also proactive choices driven by "ease of use." Domestically produced chips have crossed a critical point in terms of performance and stability, moving from "usable" to "easily usable." The same logic is unfolding in the wireless module industry— modules are moving from "connectivity" to "good connectivity," and from "connectivity" to "connectivity + intelligence . "