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Just as we were celebrating the world's first Bluetooth 6.2 module certification, another bombshell dropped: the Bluetooth Special Interest Group (SIG) has made its biggest overhaul of the BQB certification rules in nearly a decade. Bluetooth 5.4 is now mandatory, LE Audio testing is required, and RN numbers now have expiration dates . What should I do about my module selection? The days of simply "getting a module certification and relabeling it to ship" are basically over. 一、What exactly are the three changes in the new regulations? The first step: a forced upgrade of the technical benchmark. After January 1, 2026, all new BQB certification applications must comply with the Bluetooth 5.4 core specification . The SIG no longer accepts new certification applications for Bluetooth 5.3 and older versions. If the core hardware has been modified, the Bluetooth main control chip replaced, or the RF circuitry adjusted, recertification according to 5.4 is required. Even more alarming is the standard for determining "major changes." One customer simply switched antenna suppliers with the same parameters, but the SIG audit deemed it a "radio frequency circuit adjustment," requiring a complete recertification process . This means that for products that have chosen the wrong module solution, every subsequent hardware tweak could trigger costly recertification. The second blow: LE Audio has gone from being a "bonus" to a "must-have". Previously, LE Audio was an optional "bonus feature". Starting in 2026, as long as a product uses a chip with Bluetooth 5.2 or higher and the hardware supports LE Audio, regardless of whether the firmware enables the feature, all three core protocols —BAP (Broadcast Audio Profile), CAP (Audio Control Profile), and LC3 (Low Complexity Communication Codec) —must be tested. The SIG's official TCRL pkg103 clearly defines this. The LC3 codec can provide higher audio quality at a lower bit rate and reduce power consumption by about 50% compared to traditional Bluetooth audio, but on the condition that it passes the full set of LE Audio tests; missing even one test result will disqualify it . The third measure: tightening certification fees and pathways across the board. Full Bluetooth certification (non-listing method) has a single certification administration fee of up to $12,000 . If the product has multiple derivative models and the hardware/firmware (affecting the Bluetooth part) is different, an additional listing fee of $8,000 is required for each model. The core logic of the new regulations is that using certified modules through the QDL (Qualified Design List) route can significantly save certification costs and time. The QDL route allows end products to directly reference the QDID (Bluetooth Qualification ID) already obtained by the module, exempting them from numerous repetitive tests. Conversely, if the module itself has not completed 5.4+LE Audio certification, end customers will have to bear the full certification cost starting at $12,000 . II. Data Tells You: Why the New Regulations Have Such a Wide-Reaching Impact The sheer volume of Bluetooth device shipments determines the scope of the new regulations. The Bluetooth Special Interest Group (SIG) predicts that global Bluetooth device shipments will approach 6 billion units in 2026 and exceed 8 billion units in 2030. From 2025 to 2050, the average annual growth rate is projected to be approximately 8.4% . Under the new regulations, every product line—from TWS earphones and smart speakers to in-vehicle Bluetooth devices—must pass LE Audio testing if it involves Bluetooth audio functionality . Failure to pass will prevent the promotion of high-definition audio features . Furthermore, the mandatory implementation of the Bluetooth 5.4 core specification necessitates that all new products select Bluetooth modules that are compatible from the outset. 二、Ofeixin has completed the full deployment of Bluetooth 5.4+LE Audio. Shenzhen Aufexin Technology Co., Ltd. has taken the lead in completing the product layout of modules that meet the core specifications of Bluetooth 5.4 and LE Audio . The following products fully support the core technical requirements of the new BQB certification regulations in 2026: Wuqi Chip Solution - Bluetooth 5.4 + LE Audio Layout O9201PM – Wi-Fi 6 + Bluetooth 5.4 dual-mode module, PCIe interface The O9201PM is a dual-mode chip solution supporting 2×2 2.4G+5G dual-band concurrent Wi-Fi 6 and Bluetooth functionality. The Bluetooth subsystem supports Bluetooth Core Specification 5.4 and features Low Energy Audio (LE Audio) capabilities. It is fully compatible with the Bluetooth 5.4 protocol, supports BT/BLE dual-mode and BLE audio, and supports BR/EDR/LE-1M/LE-2M/LE-500k/LE-125k modulation modes. Typical application scenarios include smart speakers, Bluetooth audio devices, smart home gateways, and AIoT terminals—products with dual requirements for audio quality and wireless connectivity. O9201SB – Wi-Fi 6 + Bluetooth 5.4 dual-mode module, SDIO interface The O9201SB is a highly integrated module supporting 802.11ax Wi-Fi 6 and Bluetooth 5.4 , and dual-band simultaneous (DBS) operation at 2.4GHz and 5GHz, with a maximum speed of 1200Mbps . Measuring only 13×15mm , it features an SDIO 3.0 interface and integrates five high-performance RISC-V CPUs and a rich set of peripheral interfaces (UART, SPI, I2S, I2C, and GPIO, etc.). The Bluetooth module supports BR/EDR/LE-1M/LE-2M/LE-500k/LE-125k modulation modes. It is widely used in set-top boxes, industrial control computers, and wireless access points , and has already achieved mass production shipments in multiple China Mobile set-top boxes. O9201UB – Wi-Fi 6 + Bluetooth 5.4 dual-mode module, USB interface The O9201UB is also a dual-mode chip solution, supporting 2×2 2.4G+5G dual-band concurrent Wi-Fi 6 and Bluetooth functionality. The Bluetooth subsystem supports Bluetooth Core Specification 5.4 and features low-power audio capabilities. It boasts an ultra-compact 13×15mm size and a USB interface design. It is suitable for scenarios with specific size and interface requirements, such as set-top boxes, smart projectors, USB Wi-Fi adapters, and industrial handheld terminals. O9101SA – Wi-Fi 6 + Bluetooth 5.4 dual-mode module, SDIO interface The O9101SA is a highly integrated module that supports 802.11ax Wi-Fi 6 and Bluetooth 5.4 , and supports dual-band simultaneous (DBS) operation at 2.4GHz and 5GHz, with 5G speeds up to 886Mbps . Measuring only 12×12mm , it features an SDIO 3.0 interface and integrates five high-performance RISC-V CPUs. It supports BT/BLE dual-mode operation and uplink/downlink MU-OFDMA and MU-MIMO. It is suitable for IoT products with extremely limited space, such as smart locks, smart sensors, wearable devices, and portable medical devices. O9101UE – Wi-Fi 6 + Bluetooth 5.4 module, ultra-compact size The O9101UE is a highly integrated module that supports 802.11ax Wi-Fi 6 and Bluetooth 5.4 . Measuring only 13×12.2mm , it supports both BT and BLE dual-mode operation. It is suitable for IoT products with extremely limited space, such as smart locks, smart sensors, wearable devices, and portable medical devices. III. Three Musts for Module Selection Under the New Regulations In response to the new BQB certification regulations, the selection of Bluetooth modules must follow three principles: Bluetooth version 5.4 or higher is required. All new applications submitted from 2026 onwards must comply with the Bluetooth 5.4 specification. Choosing a module with Bluetooth version 5.3 or lower means the product will face a "no certification" dilemma from the outset. LE Audio support must be confirmed. As long as the hardware supports LE Audio, regardless of whether the feature is enabled in the firmware, the full suite of BAP, CAP, and LC3 tests will be required. When selecting a module, ensure that the module solution has completed LE Audio protocol stack adaptation and RF verification. The QDL certification path is mandatory. The full certification fee of $12,000 is a significant sum for any product team. Choosing a module solution that is already Bluetooth 5.4+LE Audio certified and referencing the module's QDID via the QDL path can significantly reduce certification costs and time . In conclusion The 2026 Bluetooth BQB certification regulations will introduce a three-pronged approach: mandatory Bluetooth 5.4 benchmark, mandatory LE Audio, and high certification fees . This is not a gradual adjustment, but a structural reshaping. For engineers and product managers developing Bluetooth products, module selection is no longer just a trade-off between "performance, power consumption, and cost," but must now include a fourth dimension—certification and compliance . Choosing the wrong module can, at best, delay the time-to-market, and at worst, trigger recertification fees of up to $12,000. Shenzhen Oufengxin Technology Co., Ltd. , with its full range of Bluetooth 5.4+LE Audio products including O9201PM, O9201SB, O9201UB, O9101SA, and O9101UE , as well as full-process technical support from module selection to certification path planning, is committed to helping customers overcome the threshold of the new BQB certification regulations in 2026 with the lowest compliance cost.  

On July 4, 2026, Huihan Technology announced that its self-developed Bluetooth protocol stack, FlairBlue, had officially passed the Bluetooth SIG 6.2 core specification certification, becoming the world's first module manufacturer to pass Bluetooth 6.2 certification . Behind this certification lies years of evolution and accumulation in Bluetooth technology. As Bluetooth 6.2 compresses the connection interval from 7.5 milliseconds to 375 microseconds, and as channel detection moves from "meter-level" to "centimeter-level," a real question arises: should Bluetooth modules use 6.0 or 6.2?   For module manufacturers, another more fundamental question arises: should they chase the latest standard version, or strive for excellence in already mature technologies? I. Bluetooth's "old problems": Why do we always have to put up with latency, dropped connections and inaccurate measurements? Prior to Bluetooth 6.2, Bluetooth technology had three core pain points that had long plagued the industry: Pain Point 1: The latency ceiling is too low. The minimum connection interval for Bluetooth Low Energy is fixed at 7.5 milliseconds . For daily office work or leisure, 7.5ms may be acceptable. However, in the competitive world where milliseconds matter—Bluetooth mice deter esports players, and Bluetooth keyboards can never keep up with wired devices in terms of response speed—this is not a problem that software can solve, but a physical bottleneck at the protocol level. Pain Point Two: Inaccurate Positioning. Traditional Bluetooth positioning relies on Received Signal Strength Indicator (RSSI). However, RSSI signals are highly susceptible to environmental interference—human obstruction, wall reflections, and multipath effects can all cause drastic signal fluctuations. Typical errors are between 3 and 5 meters . Digital car keys "standing still," asset tracking "inaccurate"—these scenarios all stem from the same problem: Bluetooth doesn't know "how far away the device is." Pain Point 3: Vulnerabilities in Secure Distance Measurement. RSSI cannot defend against relay attacks. Attackers can forge distance information with just a signal amplifier. With the rapid popularization of digital keys and keyless entry systems, distance measurement security has gone from being a "nice-to-have" to a "life-or-death" issue. These pain points combined have created an awkward reality: Bluetooth connectivity is ubiquitous, but high-end application scenarios—such as e-sports peripherals, digital keys, and industrial positioning—have been hesitant to adopt Bluetooth as their "primary solution." II. Bluetooth 6.0 vs 6.2: Two "trump cards," two different positioning methods To answer the question of "choosing 6.0 or 6.2", we first need to clarify the capability boundaries of the two generations of standards. Bluetooth 6.0 (released in September 2024): Channel detection is the biggest highlight. The most significant upgrade in Bluetooth 6.0 is its Channel Sounding feature. This technology combines Phase Scale (PBR) and Round Trip Time (RTT) for distance calculation, improving Bluetooth positioning accuracy from meter-level error (RSSI) to centimeter-level . In 2025, shipments of Bluetooth Channel Sounding modules reached 32 million units . The global BLE 6.0 Channel Sounding module market is projected to grow from $21 million in 2024 to $210 million in 2031 , representing a CAGR of 25.0% . Bluetooth 6.2 (to be released in November 2025): SCI is a decisive upgrade. Bluetooth 6.2, building upon 6.0, introduces Shorter Connection Interval (SCI) technology. SCI reduces the minimum connection interval for Bluetooth Low Energy from 7.5 milliseconds to 375 microseconds, resulting in a 20-fold increase in response speed . It can achieve a reporting rate exceeding 2 kHz under secure connections . Resolution is refined to 125 microseconds . Meanwhile, Bluetooth 6.2 includes security enhancements for channel probing—a new attack detection mechanism based on signal amplitude effectively detects and defends against sophisticated relay and spoofing attacks. This enhancement is crucial for automotive, smart home, and industrial applications. One picture to show the difference: Key findings: Bluetooth 6.0 solved the "where" problem (centimeter-level positioning), while Bluetooth 6.2 solved the "how fast" problem (ultra-low latency of 375 microseconds) and the "how secure" problem (attack-resistant ranging). They are not substitutes for each other, but rather optimal solutions for different scenarios. III. Ofeixin's Choice: Deepening its expertise in Bluetooth 6.0 and becoming a professional player in the "precise positioning" field. Faced with the industrialization wave of Bluetooth 6.2, Oufexin's strategic choice is pragmatic—focusing on mature versions of Bluetooth 6.0 and below, and maximizing the centimeter-level positioning capability of channel detection. This choice is based on rational judgment on three levels: Judgment 1: Bluetooth 6.0's channel detection capability is sufficient to cover more than 95% of current commercial scenarios. Digital keys, asset tracking, indoor navigation, access control systems—the core requirement for these scenarios is "knowing where the device is," not "how fast the response is." For the vast majority of IoT applications, Bluetooth 6.0's positioning capabilities are already "sufficient," and it is also lower in cost and has a more mature ecosystem. Judgment 2 : The industrialization of Bluetooth 6.2 still needs time. The standard was released in November 2025, and the first module certification was issued in July 2026—less than eight months indeed demonstrates the industry's rapid response. However, there is still a considerable distance between "the first certification" and "large-scale commercial use ." The penetration of terminal devices, the maturity of the software environment, and the completion of interoperability verification all require time. Rather than waiting for a standard that is not yet fully mature, it is better to perfect the technology that is already mature. Key takeaway: Oufexin's decision to focus on Bluetooth 6.0 is not because it "can't keep up," but rather based on a precise assessment of market demand—in the scenario of "precise positioning," the greatest common denominator, Bluetooth 6.0 is already powerful enough, and it is also cheaper, faster to deliver, and has a more mature ecosystem. IV. Ofeixin Technology: Professional Strength in Bluetooth 6.0 Modules Qogrisys, a professional wireless communication module supplier, has a deep understanding of the evolution trends of Bluetooth technology in terms of positioning, power consumption and connection stability, and has built a complete module product matrix covering Bluetooth 5.0 to Bluetooth 6.0. The O2072PM /O2072PB module, based on the Qualcomm QCC2072 chip, supports Bluetooth 6.0 and integrates channel sounding for high-precision distance measurement. The module uses an M.2 Key E standard interface, a 2T2R dual-antenna design, and supports both Wi-Fi and Bluetooth. Peak data rates reach up to 5.8Gbps , supporting 320MHz bandwidth and 4K QAM. It is suitable for scenarios requiring high positioning accuracy, such as digital keys, asset tracking, and smart locks. O9101SA / O9101UB — A domestically produced dual-mode module for Wi-Fi 6 and Bluetooth 5.4/5.3, supporting simultaneous operation of 2.4GHz and 5GHz dual bands (DBS). Its ultra-small 12×12mm size makes it suitable for IoT devices with limited space. O2066PM — an industrial-grade Wi-Fi 6 and Bluetooth 5.2 module that supports a wide operating temperature range of -40°C to +85°C , suitable for harsh environments such as industrial automation and smart grids. 6162C-IC / 6161B-R — Low-cost, low-power Bluetooth 5.0 modules. The 6162C-IC supports Mesh functionality, while the 6161B-R supports UART and PCM interfaces. At the product planning level, Oufexin is closely following the latest evolution of Bluetooth technology . Its Bluetooth module solutions, based on mainstream chip platforms such as Qualcomm and Realtek, possess the technological foundation to evolve to higher versions of the Bluetooth standard. From Bluetooth 5.0 to Bluetooth 6.0, Oufexin's Bluetooth module product line covers all scenarios from classic Bluetooth to Bluetooth Low Energy, from single-mode to dual-mode, and from consumer-grade to industrial-grade applications . Key takeaway: Aufexin's Bluetooth module matrix covers the entire range from Bluetooth 5.0 to Bluetooth 6.0—whether you need centimeter-level positioning for digital keys, wide-temperature reliability for industrial equipment, or high cost-effectiveness for consumer electronics, Aufexin can provide a matching module solution. In terms of technical capabilities, Oufexin provides customers with full-process technical support, from module selection, power consumption optimization, antenna design to certification testing . Bluetooth module development involves multiple stages, including RF tuning, protocol stack adaptation, and power management—Oufexin's engineering team has accumulated extensive experience in these areas, enabling them to help customers complete Bluetooth module selection, integration, and certification in the shortest possible time. V. How to play the two "trump cards"? The scenario determines the choice. Bluetooth 6.0 and 6.2 each have their own strengths, and the choice depends on the priority of latency, positioning, and security in the application scenario. Scenarios for choosing Bluetooth 6.0: Positioning is a basic requirement, and latency is not a major concern. " knowing where the device is." Bluetooth 6.0's channel detection provides centimeter-level positioning accuracy, and related modules shipped reached 32 million units in 2025. If your product requires "location" rather than "speed," Bluetooth 6.0 is currently the most cost-effective choice. Scenarios where Bluetooth 6.2 is chosen: latency-sensitive, user experience is paramount. Gaming peripherals (mice, keyboards, gamepads) – a connection interval of 375 microseconds means that 2K+ wireless polling rates are a reality. For the first time, wireless peripherals have truly caught up with the "zero-perceptible" experience of wired connections. VR/AR headsets – sub-millisecond communication cycles support smoother immersive interaction. Industrial real-time control – In high-density equipment environments, SCI’s ultra-low latency can significantly improve system response speed. Human-Computer Interface (HMI) – In scenarios such as smart car cockpits and medical device control panels, every touch a user makes can receive instant feedback . Key takeaways: If your product prioritizes an "ultimate experience"—e-sports, VR/AR, real-time control—Bluetooth 6.2 is the only correct choice. If your product prioritizes "precise positioning"—digital keys, asset tracking—Bluetooth 6.0 is sufficient, and it's also lower in cost and has a more mature ecosystem. Qogrisys offers a complete product matrix covering Bluetooth 5.0 to Bluetooth 6.0, along with end-to-end technical support from module selection to system integration. Qogrisys is committed to helping customers quickly upgrade their products and achieve commercialization during the Bluetooth 6.0 era.  

In June 2026, Chongqing Wuqi Microelectronics Co., Ltd.'s IPO application on the Science and Technology Innovation Board was accepted, with a planned fundraising of 1.619 billion yuan. This chip design company, which was one of the earliest in China to fully adopt the RISC-V architecture and achieve commercial mass production, officially stepped onto the stage of the capital market.   For Shenzhen Oufexin Technology, Wuqi Micro is not only a chip supplier, but also a deeply collaborative ecosystem partner. As a professional IoT wireless module solution provider, Oufexin is a key link in transforming Wuqi's chip technology into large-scale commercial solutions. I. Oufexin: A professional module solution provider focusing on the communication connectivity industry Shenzhen QOGRISYS Technology Co., Ltd. was founded in the communications connectivity industry. After years of experience in the industry market and customer service, it has grown into a professional solution provider with high-quality supporting resources ranging from broadband short-range wireless connections and wide area network cellular communications to deep vertical integration of the industry . The company has an annual production capacity of 4,900 KPCS, has served 245 customers, and exports its products to 7 countries . Its service capabilities cover the entire chain from solution design and module R&D to mass production and delivery. Oufexix's role is to enable chip technology to move from "laboratory verification" to "large-scale commercial use," and from "usable" to "easy to use." II. Deep Collaboration with Wuqi Micro: Development of the Full Range of Modules With its stable transmission performance and internationally leading low power consumption, the WQ9201 high-performance Wi-Fi 6 chip from Wuqi stood out from 364 products from 280 chip companies and won the 2024 "China Chip" Excellent Technological Innovation Product Award . Image source: China Chip   As a professional module solution provider, QOGRISYS collaborates closely with QOGRISYS to develop QOGRISYS's full range of modules . Currently released module products include: O9101U E , O9101UD, O9101S A – A series of 1×1 Wi-Fi 6 modules based on the WQ9101 chip from Wuqi. O9201SB, O9201UB , O9201PB , O9201PM , O9201UD , O9201UDH — A series of 2×2 Wi-Fi 6 modules based on the WQ9201 chip . Based on the technology of the Wuqi chip, Oufexin has transformed the high performance of the chip into standardized modules that can be directly integrated and quickly launched through modular design , which greatly reduces the threshold for terminal manufacturers to adopt domestic high-end Wi-Fi solutions. III. Detailed Explanation of Core Product Solutions 3.1 O9201SB: Wi-Fi 6 Module for Set-Top Boxes and Home Audio-Visual Systems a 1200Mbps SDIO 2T2R Wi-Fi 6 + BT 5.4 module developed by Oufexin based on the WQ9201 chip , with a size of only 13×15mm . This module supports all IEEE 802.11 a/b/g/n/ac/ax protocols, dual-band 2.4GHz/5GHz, and DBAC 2×2 MU-MIMO and DBDC 1×1 dual-band concurrent operation . 2.4GHz and 5GHz can operate simultaneously, supporting complete security protocols such as WPA/WPA2/WPA3, WEP, and WAPI, as well as multiple operating modes including P2P GO/GC and STA+AP . The O9201SB has been widely used in set-top boxes, industrial control computers, wireless access points, and other fields . The WQ9201 chip from Wuqi has been adopted in multiple China Mobile set-top boxes, achieving stable mass market supply . Based on this chip, the O9201SB module is quietly sparking an "experience revolution" in the set-top box industry — completely eliminating frustrating experiences such as video stuttering and soaring game latency . 3.2 O9201PM: Wi-Fi 6 Module for Industrial and Embedded Platforms The O9201PM is a 1200Mbps M.2 PCIe 2T2R Wi-Fi 6 + BT 5.4 module , measuring 22×30mm. It uses an M.2 interface and PCIe communication protocol and is mainly targeted at industrial embedded platforms, the Linux/Android open source ecosystem, and domestic SoC solutions . This module is developed based on the Wuqi WQ9201 chip, which integrates multiple high-performance RISC-V CPUs, supports a 2.4GHz/5GHz dual-band architecture and dual-band concurrency, and has achieved several breakthroughs in wireless performance: High-speed dual-band concurrency : Supports 2×2 MIMO and 80MHz bandwidth, with a theoretical speed of up to 1.2Gbps in the 5GHz band, meeting the high bandwidth requirements of industrial data acquisition, high-definition video streaming, and other applications. Superior wall penetration capability : The high-gain iPA design improves signal strength by 30% , making it suitable for complex industrial environments with multiple obstructions, such as factory workshops and warehouses. Low-power architecture : Wi-Fi and Bluetooth work together, reducing power consumption by 40%; deep sleep mode power consumption as low as μA; wake-up response time less than 10ms, suitable for battery-powered portable industrial terminals. Bluetooth 5.4 Full-Power Upgrade : 2Mbps High-Speed Transmission, Latency as Low as 30ms, Supports Bluetooth Low Energy Audio and Mesh Networking The O9201PM has completed driver adaptation and full verification on domestic platforms such as RK3588, Allwinner, and Rockchip. It can be widely used in industrial tablets, edge computing gateways, industrial control equipment, smart retail terminals, digital signage and other scenarios, providing high-performance and high-reliability Wi-Fi 6 connectivity solutions for embedded systems. In industrial manufacturing and IoT scenarios, devices constantly face challenges in wireless environments characterized by multiple obstructions, high interference, and high concurrency . Traditional Wi-Fi solutions often suffer from unstable connections and fluctuating speeds. The O9201PM is a systematic solution addressing these industrial pain points. 3.3 O9201UD/O9201UDH: Long-range Standard/Narrowband Video Transmission Module The O9201 UD/ O9201UD H is a high-power proprietary image transmission module developed by Oufexin based on the WQ9201S / WQ9201HS chip . It supports the 802.11ax Wi-Fi + BLE 5.4 protocol and has a maximum speed of 1200Mbps . This module supports the 5GHz band, with channel bandwidth covering 20MHz/40MHz/80MHz. It supports uplink MU-OFDMA TX and downlink MU-OFDMA RX, and is fully compatible with the Bluetooth 5.4 protocol . Oufexin has been committed to creating high-performance, long-range, low-latency Wi-Fi modules , primarily for applications in high-definition image transmission, drones, multi-connectivity, multi-reliability, and VR/AR scenarios . With advancements in wireless technology, image transmission solutions have evolved from Wi-Fi 5 to Wi-Fi 6. Private image transmission solutions, due to their superior anti-interference and transmission performance, are widely used in drones and are gradually being adopted by terrestrial image transmission solutions such as HDMI/IPC . O9201UD / O9201 UDH module is a prime example of this technological trend, making it an ideal choice for various smart devices and drone image transmission applications. IV. Application Scenarios: From Smart Homes to Industrial Internet of Things Oufexin's module solutions have been widely used in multiple industries: Smart Home : The module fully considers the compatibility of different smart devices, supports multiple communication protocols, and ensures the interconnection of smart home devices. Products such as water purifiers, smart projectors, and smart home appliances can achieve remote monitoring, smart reminders, and data analysis through the Oufexin Wi-Fi module. Digital consumer electronics : The modules provide cost-effective solutions suitable for various consumer electronics products, helping companies control costs and enhance market competitiveness. Smart Cities and Industrial IoT : The module adopts an advanced low-power design, maintaining low energy consumption during long-term operation and extending device battery life. Drones and HD image transmission : The O9201UD /UDH image transmission module provides long-distance, low-latency wireless connectivity for drones, VR/AR and other scenarios . V. Looking to the Future: Wi-Fi 7 and a Broader Connectivity Ecosystem Wuqi Micro plans to raise 1.619 billion yuan in its IPO, which will be mainly invested in the research and development of next-generation Wi-Fi 7 AP chips, edge smart chips, and cutting-edge technology pre-research. Wuqi's technological iteration signifies the continuous upgrading of Oufexin's module solutions. Oufexin has taken the lead in the Wi-Fi 7 arena, launching the O2072PM Wi-Fi 7 module based on the Qualcomm QCC2072. From Wi-Fi 4, Wi-Fi 5, Wi-Fi 6 to Wi-Fi 7, Oufexin has consistently been committed to leading technological trends and providing users with an exceptional wireless experience . With the rapid development of edge AI and edge computing, the requirements for bandwidth, latency, and stability of wireless connections are constantly increasing. Oufexin will continue to serve as a solution and product partner for Wuqi Chip Technology, providing more advanced wireless connectivity module solutions for smart homes, machine vision, industrial IoT, and other scenarios, from Wi-Fi 6 to Wi-Fi 7, and from traditional connections to edge AI. Conclusion The IPO of Wuqi Microelectronics is a landmark event marking the transition of domestically produced high-end Wi-Fi chips from technological breakthroughs to industrialization. Oufexix Technology, as a deep ecosystem partner of Wuqi Microelectronics, is a key force in transforming chip technology into large-scale commercial solutions. From the O9201SB revolutionizing the set-top box industry experience, to the O9201PM redefining wireless connectivity for laptops, and the O9201UD driving the upgrade of drone image transmission technology— behind each module solution lies Ophixin's commitment to its mission of "making good chips into good solutions." The RISC-V architecture has provided a historic opportunity for China's chip industry to leapfrog ahead, while Wi-Fi 7 and edge AI have opened up new market spaces. With deep synergy between chip-level innovation and module-level solution capabilities, the path to independent and controllable domestic wireless connectivity is becoming increasingly broad.